Traditional ondol 'more warm' with cutting-edge heat dissipation materials

The Korea Institute of Science and Technology (KIST) announced on the 24th that it had succeeded in developing a product that increased the heat transfer rate by 4 times by mixing a heat dissipation material with an ondol panel. Cheol-min Yang, a senior researcher at the KIST Jeonbuk Branch Structural Composite Materials Research Center, said, “It was the reverse idea of using a heat-dissipating material used to extract heat from a smartphone or machine for heating.”

Last year, the research team launched an ondol panel product measuring 1m in width and 0.5m in size. KIST has also developed a technology that can print heat-dissipating materials in the form of small pieces of pellets and put them in a facility to print tiles as if they were printing plastic. The technology transfer was also completed in October last year. Hoya Hometech, which jointly developed this panel with the research team for two years, built a production facility with an annual capacity of 13,000 tons. We are currently exporting to the US and Canada.

동아일보 : https://www.donga.com/news/Economy/article/all/20220227/112068021/1